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  1. Intel's 45nm CMOS Technology

    Process Variation in Intel’s 45nm CMOS Technology Process and Electrical Results for the On-die Interconnect Stack for Intel’s 45nm Process Generation ... 12 2 Not Available 1535-864X 10.1535/itj.1202 Foreward Intel's 45nm CMOS Technology Podcast ...

  2. Process and Electrical Results for the On-die Interconnect Stack for Intel’s 45nm Process Generation

    This paper introduces the issues associated with on-die interconnects and describes how they are addressed on Intel’s 45nm high-performance, logic process technology. The 45nm process generation uses ... process-and-electrical-results-for-the-on-die-interconnect-stack-for-intels-45nm-process-generation.pdf ...

  3. Managing Process Variation in Intel’s 45nm CMOS Technology

    the 45nm process generation where process variation is shown to be at least equivalent to (and in many ... in the 45nm generation to mitigate the impact of variation. Pure process mitigation techniques include ... to determine both systematic and random within-wafer and within-die variation for 45nm versus 65nm products. ...

  4. Flip-Chip Packaging Technology for Enabling 45nm Products

    to select and integrate the new assembly materials into the complex interconnect structure of Intel’s 45nm ... These technologies have been introduced into high-volume manufacturing to enable packaging of 45nm silicon devices ... and it is more reliable and environmentally friendly, being 100% Pb-free. The development of the high-k 45nm ...

  5. 45nm SRAM Technology Development and Technology Lead Vehicle

    Intel’s revolutionary 45nm technology was instrumental for aggressive SRAM scaling. The tileable SRAM ... “X-chip.” X6 is the technology lead vehicle used for the 45nm technology serving as a platform ... ramp at the 45nm technology node. 45nm-sram-technology-development-and-technology-lead-vehicle.pdf ...

  6. 45nm Transistor Reliability

    with Intel’s 45nm process technology. A particularly extensive effort was undertaken to characterize ... through refinement of process architecture and optimization of processing conditions. Intel’s 45nm ... with metal gate electrodes (HK+MG) transistors in its 45nm logic process, as it judged the transition ...

  7. Mobility Thin and Small Form-Factor Packaging for Intels Processors Based on Original 45nm Intel Coret Microarchitecture

     The Intel 45nm processor, originally referred to by the codename Penryn, based on Intel Coret microarchitecture, is the first processor that uses multicore-on-die design to maximize performance and minimize ... mobility-thin-and-small-form-factor-packaging-for-intels-processors-based-on-original-45nm-intel-cor.pdf ...

  8. 45nm Design for Manufacturing

    manufacturing requirements. The variation, density, and yields on the 45nm process show the success of this Design for Manufacturing (DFM) methodology. 45nm-design-for-manufacturing.pdf ... Co-optimization between design and process is required for a highly manufacturable process ...

  9. 45nm High-k+Metal Gate Strain-Enhanced Transistors

    For the 45nm technology node, high-k+metal gate transistors have been introduced for the first time in a high-volume manufacturing process [1]. The introduction of a high-k gate dielectric enabled ... single-, dual-, quad-, and six-core microprocessors. 45nm-high-kmetal-gate-strain-enhanced-transistors.pdf ...

  10. The Tick Tock Beat of Microprocessor Development at Intel

    that straddle two process technologies. The focus here will be on the Intel® microarchitecture code-name Nehalem (45nm Tock) and the Intel® microarchitecture code name Westmere (32nm Tick) generation ... on the work of Intel's Converged Core Development Organization, the content architect for this edition ...

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